High heat-resistant Polyimide film
It has the highest level of dimensional stability and heat resistance among polymer films, and is suitable as a substitute or composite material for glass, silicon wafers and ceramics.
Feature
1.Excelent dimensional stability
Low CTE equivalent to glass plate/Low heat shrinkage at high temperature (CTE: Coefficient of thermal expansion)
2.Excellent heat resistance
No warpage at 500℃
3.Excellent surface flatness
Surface flatness comparable to glass surface(Ra≒0.5nm)
Properties
Coefficient of thermal expansion(CTE)
Heat Resistance
Applications
Flexible TFT and circuit board applications for electronic paper and sensors, heat-resistant insulation, heat-resistant release film applications, heat-resistant packing applications, etc.
Electric Paper
Fingerprint Sensor
Chip on Film(COF)
Electric Shelf label
micro LED display
(signage･backlight)
(signage･backlight)
Organic electroluminescent display
Data
Xenomax®️Detailed data can be downloaded in PDF format.
