Xenomax - Japan Co., Ltd.
Xenomax
Products
High heat-resistant Polyimide film
ゼノマックス
Xenomax®
It has the highest level of dimensional stability and heat resistance among polymer films, and is suitable as a substitute or composite material for glass, silicon wafers and ceramics.
Feature
1.Excelent dimensional stability
Low CTE equivalent to glass plate/Low heat shrinkage at high temperature (CTE: Coefficient of thermal expansion)
2.Excellent heat resistance
No warpage at 500℃
3.Excellent surface flatness
Surface flatness comparable to glass surface(Ra≒0.5nm)
Properties
特性
Coefficient of thermal expansion(CTE)
Coefficient of thermal expansion(CTE)
Heat Resistance
Heat Resistance
Applications
Flexible TFT and circuit board applications for electronic paper and sensors, heat-resistant insulation, heat-resistant release film applications, heat-resistant packing applications, etc.
Electric Paper
Electric Paper
Fingerprint Sensor
Fingerprint Sensor
Chip on Film(COF)
Chip on Film(COF)
Electric Shelf label
Electric Shelf label
micro LED display
(signage・backlight)
micro LED display
(signage・backlight)
Organic electroluminescent display
Organic electroluminescent display
Data
Xenomax® Detailed data download
Xenomax®️Detailed data can be downloaded in PDF format.